The internal block diagram of the WCD9341 consists of three primary domains: Analog Front-End (AFE), Digital Signal Processing (DSP) Core, and Power Management. Digital Signal Processing (DSP) Engine
: Optimized for mobile devices to deliver crystal-clear audio with minimal battery impact. Advanced Features wcd9341 datasheet
The is a premium-tier, high-fidelity (Hi-Fi) audio codec chip belonging to the Qualcomm Aqstic audio platform . Widely integrated alongside flagship processors like the Snapdragon 835, this 40nm integrated circuit (IC) powers the comprehensive voice processing and sound path control found in premier legacy flagships, such as the Samsung Galaxy Note 8 and Galaxy S9 . The internal block diagram of the WCD9341 consists
Analog Inputs ──┬── ADC0 (Main Mic) ├── ADC1 (Secondary Mic) ├── ADC2 (ANC/Reference) └── ADC3 (Line-in/Headset detect) ↓ Digital Decimation Filters ↓ ┌─────────────────────────┐ │ Audio DSP (Qualcomm Hexagon, 240 MHz) │ │ - FIR/IIR filters │ │ - Dynamic Range Control │ │ - Sample rate converter │ └─────────────────────────┘ ↓ ┌─────────────────────────┐ │ Hi-Fi DAC (32-bit, 384 kHz) │ │ - DSD direct path │ │ - 4th-order noise shaping │ └─────────────────────────┘ ↓ Class-H Headphone Amp (L+R) ↓ HP_L, HP_R output pins Based on the official preliminary datasheet (Rev 1
Capable of delivering up to 30mW per channel into 32Ω loads, and up to 5mW into 600Ω high-impedance audiophile headphones.
Simultaneously handles different sample rates, such as 44.1 kHz for playback while recording at 48 kHz .
Based on the official preliminary datasheet (Rev 1.4, 2016) and internal Qualcomm validation reports: